The new Intel Core Ultra 9 285K processor breaks the world overclocking record with an LN2 optimized heatsink and exceeds 7.4 GHz

The new Intel Core Ultra 9 285K processor was used with the ASUS ROG Maximus Z890 Apex motherboard and an LN2-optimized heatsink from Diabatix to set a number of world overclocking records with the processor overclocked to an insane 7448 MHz (7.4 GHz).

This achievement was made possible through a collaboration between ElmorLabs Ltd., BenchMarc, OGS and CENS using a copper heatsink designed by Diabatix and manufactured by 3D Systems. The teams used the new flagship Intel Core Ultra 9 285K processor and ASUS ROG Maximus Z890 Apex motherboard with LN2 cooling and copper heatsink designed by Diabatix and manufactured by 3D Systems.

The heatsink was specifically designed to work with liquid nitrogen, which as we all know, as an extremely low temperature substance, ensures continuous and stable performance in high temperature environments (like overclocking the hell out of the new Core Ultra 9 processor). 285K processor). Diabatix notes on its website that liquid nitrogen is commonly used in high-performance refrigeration due to its ability to operate at ultra-low temperatures, but “Operating effectively in these environments also requires carefully designed components.“.

Diabatix explained in a post on its website: “In this case, Diabatix had to optimize the design to take into account the Leidenfrost effect, a phenomenon in which a liquid is protected by an insulating layer of vapor when in contact with a surface above its boiling point, preventing it from rapidly boiling. The radiator is designed without horizontal surfaces, which allows steam to be smoothly discharged through vertical tubes, avoiding the formation of vapor layers. ColdStream’s design was intended to maximize heat transfer by integrating two-phase boiling physics using liquid nitrogen as the coolant, which maintains an even temperature thanks to a constant boiling point of -196°C.“.

“This uniformity results in an efficient radiator structure with a tree-like design, with thicker roots at the base and thinner tubes at the top to optimize heat distribution and vapor removal. The tree-like design promotes efficient heat distribution from the base to the fin tips, allowing steam bubbles generated during boiling to escape, preventing heat transfer from being hampered. Finally, copper was chosen over aluminum due to its higher thermal conductivity, minimizing temperature differences and further improving cooling efficiency.“.

If you would like details about all the Organizing Committee’s world records, ASUS has a fantastic review. explaining all the records that have been broken with the new ROG Maximus Z890 Apex motherboard.